I suppose it depends on what you’re molding. I have a lot of experience with polypropylene, polystyrene, cyclic olefin copolymer, and polycarbonate, and all of these materials typically get primary vents .0004/0006in deep. You could push those up to .0010in. which is 25 microns with just a little risk of flash, but at 25 micron resolution it would be hit or miss if you would get vent or not. As for venting I am more concerned with the temperature of the gasses. They super-heat so they are much hotter than the melt temp of the material being injected into the cavity… I wonder how much these gasses play into the life of the SLA tool.
Then you have the whole cooling thing. I design molds for the life sciences industry so they can be pretty complicated. I am always thinking about better ways to cool the mold, utilizing beryllium copper and other high thermal conductivity materials for decreased cycle time. Now, I understand that cycle time is not a major player in this scenario, but I am guessing the thermal conductivity of the high temp resin is not very good. To be fair I haven’t looked at the data sheet. But, if the resin is ok with water running through it I suppose you could do conformal cooling to make up for it the lack of thermal conductivity.
The more I think about this the more I realize there is a lot to consider. I am very interested to explore all of this, but need a project to justify it. That is the hard part.
How many of “us” are there in these forums? It’d be good to ask for a sub forum or something where a bunch of us could brainstorm, maybe work together on some experiments, sharing physical resources and skills to get some of these questions answered, and maybe develop some guidelines for us to be successful. This way we don’t all have to go through the same pains individually.
Thoughts? Now I need to go watch our countries absolutely ridiculous and embarrassing election unfold. What a mess.