The Raise3D “roll out” build unit did have me think of possibly a “pull out” Hopper/Doser assembly on a next generation Fuse…or something like that… allowing an easier swap in materials for side projects.
I would like to be able to try and run TPU once in awhile for some components in our assemblies but I can’t justify an entire Fuse system for it… so would be nice to minimize the clean out time and mess to do so if possible.
Blowing out that hopper and doser is an ordeal… would be interesting to be able to swap that assembly, build chamber and then do a simple vacuuming out and wipe down of the inside of the Fuse before a swap.
Of course, you’d need another SIFT… and at that point what’s another Fuse I guess…
This technology needs to be able to come down in powder price and out of that Prototyping, Aerospace and Defense pricing of parts before anything else to make its production part running feasible for the general consumer products…and I’m hopeful someone will break the code on that soon.
The hardware does not need to evolve…the failure rate + upkeep can be offset by a drop in material costs…hopefully a little competition can help bring this down so we can leave this classic “HP printer ink” business model behind.
10kg bags of powder need to come down from $1,000 first and foremost.


